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AIA/NAS - NAS4124

HEAT SINK, ELECTRICAL/ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, DUAL LINK

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Organization: AIA/NAS
Publication Date: 31 August 2012
Status: active
Page Count: 4

Document History

NAS4124
August 31, 2012
HEAT SINK, ELECTRICAL/ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, DUAL LINK
A description is not available for this item.
NAS4124
January 1, 1996
Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
A description is not available for this item.

References

This document references:
B194 - Standard Specification for Copper-Beryllium Alloy Plate, Sheet, Strip, and Rolled Bar
July 1, 2022
This specification establishes the requirements for copper-beryllium alloy plate, sheet, strip, and rolled bar. Unless otherwise specified in the contract or purchase order, Copper Alloy UNS No....
This document references:
ASTM B534 - Standard Specification for Copper-Cobalt-Beryllium Alloy and Copper-Nickel-Beryllium Alloy Plate, Sheet, Strip, and Rolled Bar
Published by ASTM on April 1, 2020
This specification establishes the requirements for plate, sheet, strip, and rolled bar. Units—The values stated in inch-pound units are to be regarded as standard. The values given in parentheses...
This document references:
B766 - Standard Specification for Electrodeposited Coatings of Cadmium
May 1, 2023
This specification covers the requirements for electrodeposited cadmium coatings on products of iron, steel, and other metals. NOTE 1—Cadmium is deposited as a coating principally on iron and steel...
This document references:
ASME Y14.5 - Dimensioning and Tolerancing
Published by ASME on January 1, 2018
INTRODUCTION This Standard establishes symbols, rules, definitions, requirements, defaults, and recommended practices for stating and interpreting dimensioning, tolerancing, and related requirements...
This document references:
MIL-F-495 - FINISH, CHEMICAL, BLACK, FOR COPPER ALLOYS
Published by NPFC on September 30, 1988
This document covers a black chemical finish for copper alloys.
This document references:
MIL-H-87111/8 CANC NOTICE 3 - HEAT SINKS, SEMICONDUCTOR DEVICES, CLASS 2 (DUAL LINK)
Published by DLA on November 20, 2000
A description is not available for this item.
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