IPC-TR-579
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards
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| Organization: | IPC |
| Publication Date: | 1 September 1988 |
| Status: | active |
| Page Count: | 90 |
scope:
Objective
The "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards" had the following objectives:
• Evaluate the performance of small diameter PTHs under controlled environmental conditlons.
• Evaluate the influence of the thickness and quality of deposited copper on PTH performance.
• Determlne the impact of varying PTH aspect ratios.
• Collect data on the influence of product design or manufacturing methods.
• Determine if test results from different military and industrial thermal cycle and/or thermal shock procedures can be correlated.
Document History
IPC-TR-579
September 1, 1988
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards
Objective
The "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards" had the following objectives:
• Evaluate the performance of small diameter...