IEC - 60249-2-19
Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
inactive, Most Current
| Organization: | IEC |
| Publication Date: | 1 January 1992 |
| Status: | inactive |
| Page Count: | 42 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
60249-2-19
January 1, 1992
Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
A description is not available for this item.