IPC - J-STD-006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
|Publication Date:||1 July 2013|
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for ''special form'' (see 1.2.3) electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry. The other two joint industry standards are:
J-STD-004 Requirements for Soldering Fluxes
-STD-005 Requirements for Soldering Pastes