IPC-TM-650 2.4.1.2
Adhesion of Conductors on Hybrid Substrates
active, Most Current
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| Organization: | IPC |
| Publication Date: | 1 December 1987 |
| Status: | active |
| Page Count: | 2 |
scope:
This method is to determine the adhesion or bonding quality of conductors on hybrid substrates.
Document History
IPC-TM-650 2.4.1.2
December 1, 1987
Adhesion of Conductors on Hybrid Substrates
This method is to determine the adhesion or bonding quality of conductors on hybrid substrates.