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IPC - M-106

Technology Reference for Design Manual

inactive, Most Current
Organization: IPC
Status: inactive
Page Count: 1,612
scope:

This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each area.

The goal in packaging is to transfer a signal from one device to one or more other devices, through a conductor.  High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique consideration.

 

Document History

M-106
Technology Reference for Design Manual
This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each area. The goal in...
Technology Reference for Design Manual
A description is not available for this item.

References

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