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NPFC - MIL-C-47224

COMPOUND MOLDING, TRANSFER, EPOXY RESIN, SINGLE-COMPONENT

active, Most Current
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Organization: NPFC
Publication Date: 4 January 1993
Status: active
Page Count: 13
scope:

This specification covers one type of single-component, epoxy resin transfer molding compound for encapsulating, potting, and embedding electrical devices requiring good thermal conductivity.

intended Use:

The molding compound covered by this specification is intended for use in transfer molding applications requiring high overall strength as well as good thermal shock properties. In the use of the... View More

Document History

April 25, 2018
Compound, Molding, Transfer, Epoxy Resin, Single-Component
A description is not available for this item.
April 17, 1996
COMPOUND MOLDING, TRANSFER, EPOXY RESIN, SINGLE-COMPONENT
NOTICE OF INACTIVATION FOR NEW DESIGN This notice should be filed in front of MIL-C-47224B (MI), dated 4 January 1993. MIL-C-47224B (MI) is inactive for new design and is no longer used, except for...
MIL-C-47224
January 4, 1993
COMPOUND MOLDING, TRANSFER, EPOXY RESIN, SINGLE-COMPONENT
The molding compound covered by this specification is intended for use in transfer molding applications requiring high overall strength as well as good thermal shock properties. In the use of the...
December 14, 1987
COMPOUND MOLDING, TRANSFER, EPOXY RESIN, SINGLE-COMPONENT
A description is not available for this item.
February 20, 1981
COMPOUND MOLDING, TRANSFER, EPOXY RESIN, SINGLE-COMPONENT
A description is not available for this item.
July 12, 1974
COMPOUND MOLDING, TRANSFER, EPOXY RESIN, SINGLE-COMPONENT
A description is not available for this item.

References

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