IPC - TM-650 2.4.13.1
Thermal Stress of Laminates
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 December 1994 |
| Status: | active |
| Page Count: | 2 |
scope:
This test method is designed to determine the thermal integrity of unclad or metallic clad laminates using short-term solder exposure.
Document History
TM-650 2.4.13.1
December 1, 1994
Thermal Stress of Laminates
This test method is designed to determine the thermal integrity of unclad or metallic clad laminates using short-term solder exposure.