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IPC - TM-650 2.4.13.1

Thermal Stress of Laminates

active, Most Current
Organization: IPC
Publication Date: 1 December 1994
Status: active
Page Count: 2
scope:

This test method is designed to determine the thermal integrity of unclad or metallic clad laminates using short-term solder exposure.

Document History

TM-650 2.4.13.1
December 1, 1994
Thermal Stress of Laminates
This test method is designed to determine the thermal integrity of unclad or metallic clad laminates using short-term solder exposure.

References

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