UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.4.1.3

Adhesion, Resistors (Hybrid Circuits)

inactive, Most Current
Organization: IPC
Publication Date: 1 December 1987
Status: inactive
Page Count: 1
scope:

This test method is to determine the adhesion quality of resistive and capacitive materials on the substrate surface of finished hybrid circuits.

Document History

TM-650 2.4.1.3
December 1, 1987
Adhesion, Resistors (Hybrid Circuits)
This test method is to determine the adhesion quality of resistive and capacitive materials on the substrate surface of finished hybrid circuits.

References

Advertisement