IPC - TM-650 2.4.42.2
Die Shear Strength
inactive, Most Current
| Organization: | IPC |
| Publication Date: | 1 February 1998 |
| Status: | inactive |
| Page Count: | 2 |
scope:
The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization.
Document History
TM-650 2.4.42.2
February 1, 1998
Die Shear Strength
The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted elements to package headers or other substrates. This...