JEDEC JEP 128
Guide for Standard Probe Pad Sizes and Layouts for Wafer-Level Electrical Testing
| Organization: | JEDEC |
| Publication Date: | 1 November 1996 |
| Status: | active |
| Page Count: | 11 |
scope:
This guide was developed to expedite inter-laboratory experiments used to evaluate or develop standard test methods that involve test-structure measurements or tests. It also facilitates, generally, any electrical tests that require wafer-probe card to make electrical contact to test structures. Widespread use of this guide will afford the efficient and cost-effective use of water-probe test stations because of the need for fewer probe cards and probe-card changes to accommodate the various test structures that may need to be tested.
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