CENELEC - EN 60191-6-3
Mechanical Standardization of Semiconductor Devices - Part 6-3: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Measuring Methods for Package Dimensions of Quad Flat Packs (QFP)
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 December 2000 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
EN 60191-6-3
December 1, 2000
Mechanical Standardization of Semiconductor Devices - Part 6-3: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Measuring Methods for Package Dimensions of Quad Flat Packs (QFP)
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