scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54FCT299 8-input universal shift register, TTL compatible with three-state outputs 02 54FCT299A 8-input universal shift register, TTL compatible with three-state outputs

The case Outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range (V_CC) - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc Output voltage range - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc DC input diode current (I_IK) - - - - - - - - - - - - - −20 mA DC output diode current (I_OK) - - - - - - - - - - - - −50 mA DC output current - - - - - - - - - - - - - - - - - - ±100 mA Maximum power dissipation (P_D) 2/ - - - - - - - - - - 500 mW Thermal resistance, junction-to-case (θ_JC) - - - - - - See MIL-M-38510, appendix Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Junction temperature (T_J) - - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - - - +300°C

Supply voltage range (V_CC) - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum low level input voltage (V_IL) - - - - - - - - 0.8 V dc Minimum high level input voltage (V_IH) - - - - - - - - 2.0 V dc Case operating temperature range (T_C) - - - - - - - - −55°C to +125°C

Minimum setup time, S₀ or S₁ to CP (t_s): Device type 01 - - - - - - - - - - - - - - - - - - - 7.5 ns Device type 02 - - - - - - - - - - - - - - - - - - - 4.0 ns Minimum hold time, S₀ or S₁ to CP (t_h): Device type 01 - - - - - - - - - - - - - - - - - - - 1.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - 1.0 ns Minimum setup time, I/O_n, DS₀ or DS₇ to CP (t_s): Device type 01 - - - - - - - - - - - - - - - - - - - 5.5 ns Device type 02 - - - - - - - - - - - - - - - - - - - 4.5 ns Minimum hold time, I/O_n, DS₀ or DS₇ to CP (t_h) - - - 1.5 ns Device type 01 - - - - - - - - - - - - - - - - - - - 1.5 ns Device type 02 - - - - - - - - - - - - - - - - - - - 1.5 ns Minimum CP pulse width, high or low (t_w): Device type 01 - - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - 6.0 ns Minimum [M bar][R bar] pulse width, low (t_w): Device type 01 - - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - 6.0 ns Minimum removal time, [M bar][R bar] to CP (t_rem): Device type 01 - - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - 6.0 ns

intended Use: