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NPFC - MIL-W-82598

WIRE, COPPER-CADMIUM ALLOY

active, Most Current
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Organization: NPFC
Publication Date: 7 September 1988
Status: active
Page Count: 1

Document History

MIL-W-82598
September 7, 1988
WIRE, COPPER-CADMIUM ALLOY
A description is not available for this item.
MIL-W-82598
February 14, 1972
WIRE, COPPER-CADMIUM ALLOY
This specification covers solid, round, copper-cadmium alloy wire. The alloy of wire covered by this specification shall be as furnished in the hard temper. The wire covered by this specification...

References

This document references:
ASTM B193 - Standard Test Method for Resistivity of Electrical Conductor Materials
Published by ASTM on November 1, 2020
This test method covers the determination of the electrical resistivity of metallic electrical conductor material. It provides for an accuracy of 60.30 % on test specimens having a resistance of...
This document references:
E8/E8M - Standard Test Methods for Tension Testing of Metallic Materials
May 1, 2022
These test methods cover the tension testing of metallic materials in any form at room temperature, specifically, the methods of determination of yield strength, yield point elongation, tensile...
This document references:
FED-STD-123J - Marking for Shipment (Civil Agencies)
Published by GENERAL SERVICES on May 19, 2021
This document establishes requirements for marking of unit, intermediate, transport packages, and unit loads for shipments of purchased commodities (items) from government contractors or vendors to...
This document references:
MIL-STD-129R CHANGE 3 - MILITARY MARKING FOR SHIPMENT AND STORAGE
Published by ARMY on February 25, 2023
Purpose. This standard provides the minimum requirements for uniform military marking for shipment and storage. Additional marking may be required by the contract or the cognizant activity....
This document is referenced by:
IPC-DW-424 - General Specification for Encapsulated Discrete Wire Interconnection Board
Published by IPC on January 1, 1995
This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards having wires which terminate in plated holes.
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