UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.6.16.1

Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)

active, Most Current
Organization: IPC
Publication Date: 1 August 1998
Status: active
Page Count: 2
scope:

This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated constructions, the results may be affected by the process conditions.

Document History

TM-650 2.6.16.1
August 1, 1998
Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)
This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated...

References

Advertisement