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IEC - 60874-15

Connectors for optical fibres ancl cables Part 15: Sectional specification for fibre optic connector - Type DS

inactive, Most Current
Organization: IEC
Publication Date: 1 January 1994
Status: inactive
Page Count: 24

Document History

60874-15
January 1, 1994
Connectors for optical fibres ancl cables Part 15: Sectional specification for fibre optic connector - Type DS
A description is not available for this item.

References

This document is referenced by:
BS EN 60875-1 - Fibre optic interconnecting devices and passive components - Non-wavelength-selective fibre optic branching devices Part 1: Generic specification
Published by BSI on July 31, 2015
A description is not available for this item.
This document is referenced by:
EN 60874-1 - Fibre optic interconnecting devices and passive components - Connectors for optical fibres and cables - Part 1: Generic specification
Published by CENELEC on March 1, 2012
This part of IEC 60874 applies to fibre optic connector sets and individual components (i.e. adaptors, plugs, sockets) for all types, sizes and structures of fibres and cables. It includes: –...
This document is referenced by:
CEI EN 62150-2 - Fibre optic active components and devices - Test and measurement procedures Part 2: ATM-PON transceivers
Published by CEI on April 1, 2012
This part of IEC 62150 specifies testing and measuring procedures for fibre optic transceivers for asynchronous-transfer-mode passive optical network (ATM-PON) systems recommended by ITU-T G.983.1....
This document is referenced by:
IEC 62148-15 - Fibre optic active components and devices – Package and interface standards – Part 15: Discrete vertical cavity surface emitting laser packages
Published by IEC on March 1, 2021
This part of IEC 62148 covers the physical dimension and interface specifications for discrete vertical cavity surface emitting laser (VCSEL) devices in optical telecommunication and optical data...
This document is referenced by:
IPC-0040 - Optoelectronics Assembly and Packaging Technology
Published by IPC on May 1, 2003
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component...
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