IPC - TM-650 2.4.23
Soldering Resistance of Laminate Materials
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 March 1979 |
| Status: | active |
| Page Count: | 2 |
scope:
This test method is used to determine the resistance of laminate materials (both unclad and etched surfaces) to the thermal abuse of a solder dip. Resistance to softening, loss of surface resin, scorching, delamination, blistering and measling are considered in the evaluation.
Document History
TM-650 2.4.23
March 1, 1979
Soldering Resistance of Laminate Materials
This test method is used to determine the resistance of laminate materials (both unclad and etched surfaces) to the thermal abuse of a solder dip. Resistance to softening, loss of surface resin,...