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IPC - TM-650 2.6.10A

X-Ray (Radiography), Multilayer Printed Wiring Printed Board Test Methods

active, Most Current
Organization: IPC
Publication Date: 1 August 1997
Status: active
Page Count: 2
scope:

This non-destructive inspection method is needed to ascertain the following conditions:

a. Innerlayer shift is within acceptable tolerances.

b. One or more inner layers have not been reversed.

c. Drilled holes are aligned with pads to the extent that any break-out is within acceptable tolerances.

d. The minimum distance between a drilled hole and a ground plane clearance is within acceptable tolerances.

The test method will entail passing X-rays through the test specimen and converting the transmitted X-ray image into a visual image through the use of either X-ray film or a flouro- scopic (real time) device.

Cautionary notes:

The construction of the multilayer with respect to; number of layers, thickness of copper and presence other metals such as heat sinks (e.g. Invar), will determine the power and sensitivity of the X-ray apparatus which can be used. All X-ray apparatus should be registered with the appropriate state or regional Radiation Control agency.

A radiation safety program should be implemented.

Document History

TM-650 2.6.10A
August 1, 1997
X-Ray (Radiography), Multilayer Printed Wiring Printed Board Test Methods
This non-destructive inspection method is needed to ascertain the following conditions: a. Innerlayer shift is within acceptable tolerances. b. One or more inner layers have not been reversed. c....
July 1, 1975
X-Ray (Radiography) Multilayer Printed Wiring
A description is not available for this item.

References

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