UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.6.20A

Assessment of Plastic Encapsulated Electronic Components for Susceptibility to Moisture/Reflow Induced Damage

inactive, Most Current
Organization: IPC
Publication Date: 1 January 1995
Status: inactive
Page Count: 5

Document History

TM-650 2.6.20A
January 1, 1995
Assessment of Plastic Encapsulated Electronic Components for Susceptibility to Moisture/Reflow Induced Damage
A description is not available for this item.

References

This document is referenced by:
IPC-9501 - PWB Assembly Process Simulation for Evaluation of Electronic Components
Published by IPC on July 1, 1995
This document describes manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after...
This document is referenced by:
IPC-6015 - Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
Published by IPC on February 1, 1998
This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic...
This document is referenced by:
IPC-D-279 - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Published by IPC on July 1, 1996
This document establishes design concepts, guidelines, and procedures intended to promote appropriate ‘Design for Reliability (DfR)’ procedures and to ensure reliable printed wiring assembly (PWA)...
Advertisement