IPC - TM-650 2.3.24.1
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 October 1985 |
| Status: | active |
| Page Count: | 3 |
scope:
This test method provides a procedure for testing the porosity of gold electroplated from an alkaline (cyanide), acid, or neutral gold plating solution on a nickel substrate in contact with the gold deposit.
Document History
TM-650 2.3.24.1
October 1, 1985
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method
This test method provides a procedure for testing the porosity of gold electroplated from an alkaline (cyanide), acid, or neutral gold plating solution on a nickel substrate in contact with the gold...