IPC-CA-821
General Requirements for Thermally Conductive Adhesives
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| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 17 |
scope:
This document covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as a part of the printed wiring board.
Document History
IPC-CA-821
January 1, 1995
General Requirements for Thermally Conductive Adhesives
This document covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as a part of the printed wiring board.