UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IEC 61163-1

Reliability stress screening – Part 1: Repairable assemblies manufactured in lots

active, Most Current
Buy Now
Organization: IEC
Publication Date: 1 June 2006
Status: active
Page Count: 170
ICS Code (Characteristics and design of machines, apparatus, equipment): 21.020
ICS Code (Application of statistical methods): 03.120.30
ICS Code (Quality in general): 03.120.01
scope:

This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable. The reasons for using reliability stress screening may be time constraints and/or the very nature of the deficiencies that the reliability stress screening is designed to catch.

The processes apply to any stage of a series production of repairable assemblies (see Figure 3). The methods for setting up a process can be used during production planning, during pilot-production, as well as during well-established running production.

A prerequisite for the application of the methods is that a certain level of flaws remaining in the outgoing assembly can be specified.

The processes described are general processes for reliability stress screening in cases where no specific process is described in a product standard. They are also intended for use by IEC committees in connection with preparation of product standards. A reliability stress screening process can form part of an overall reliability programme (see IEC 60300-2).

Document History

IEC 61163-1
June 1, 2006
Reliability stress screening – Part 1: Repairable assemblies manufactured in lots
This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an...
July 1, 1995
Reliability Stress Screening - Part 1: Repairable Items Manufactured in Lots
A description is not available for this item.

References

Advertisement