DLA - SMD-5962-89659
MICROCIRCUIT, LINEAR, FET BUFFER, HYBRID
| Organization: | DLA |
| Publication Date: | 4 September 1990 |
| Status: | active |
| Page Count: | 12 |
scope:
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534.
The complete part number shall be as shown in the following example:
The device type shall identify the circuit function as follows:
Device type Generic number Circuit function 01 EL2004 FET buffer
The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:
Outline letter Case outline X (See figure 1, TO-8 (12-lead can)) Y C-6 (52-lead, .761" × .761" × .120"), square leadless chip carrier
Supply voltage (VS) - - - - - - - - - - - - - - - - - - - ±20 V dc Input voltage (VIN) - - - - - - - - - - - - - - - - - - - ±20 V dc Power dissipation (PD): Case X - - - - - - - - - - - - - - - - - - - - - - - - 1.5 W Case Y - - - - - - - - - - - - - - - - - - - - - - - - 2.5 W Peak output current (Iop) - - - - - - - - - - - - - - - - ±250 mA Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - 300°C Thermal resistance, junction-to-case (θJC): Case X - - - - - - - - - - - - - - - - - - - - - - - - 31°C/W Case Y - - - - - - - - - - - - - - - - - - - - - - - - 25°C/W Thermal resistance, junction-to-ambient (θJA): Case X - - - - - - - - - - - - - - - - - - - - - - - - 100°C/W Case Y - - - - - - - - - - - - - - - - - - - - - - - - 60°C/W Operating junction temperature (TJ) - - - - - - - - - - - +175°C
Positive supply voltage (V+) - - - - - - - - - - - - - - +15 V dc Negative supply voltage (V−) - - - - - - - - - - - - - - −15 V dc Ambient operating temperature range (TA) - - - - - - - - −55°C to +125°C
Unless otherwise specified, the following specifications, standard, and bulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein.
SPECIFICATIONS MILITARY MIL-M-38510 - Microcircuits, General Specification for. MIL-H-38534 - Hybrid Microcircuits, General Specification for. STANDARD MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMD's).
(Copies of the specifications, standard, and bulletin required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.)
In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence.
intended Use:
Microcircuits conforming to this drawing are intended for original equipment design applications and logistic support of existing equipment.
Document History