IPC - TM-650 2.6.8.1
Thermal Stress, Laminate
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 September 1991 |
| Status: | active |
| Page Count: | 1 |
scope:
To determine the resistance of the laminate to thermal stress in both the etched and unetched state.
Document History
TM-650 2.6.8.1
September 1, 1991
Thermal Stress, Laminate
To determine the resistance of the laminate to thermal stress in both the etched and unetched state.