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NPFC - MIL-P-46067

PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM

active, Most Current
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Organization: NPFC
Publication Date: 7 March 2000
Status: active
Page Count: 1

Document History

March 17, 2015
Plastic Embedding Compound, Epoxy Resin System
A description is not available for this item.
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
MIL-P-46067
March 7, 2000
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
October 20, 1998
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
February 9, 1977
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
The epoxy embedding compounds are intended for use in encasing coils, capacitors and the like, or in assemblies of electrical components or for forming small structural details of an electrical...
March 1, 1971
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
August 20, 1965
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
October 25, 1963
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.

References

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