IPC - TM-650 2.4.24.5
Glass Transition Temperature and Thermal Expansion of Materials Used in High Density Interconnection (HDI) and Microvias - TMA Method
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 November 1998 |
| Status: | active |
| Page Count: | 5 |
scope:
This test is designed to determine the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) of dielectric materials used in high density interconnect (HDI) and microvias by the use of thermal mechanical analysis (TMA). For isotropic (unreinforced) materials, either method (A = thick specimen; B = thin specimen) may be used. For anisotropic materials (reinforced), both methods shall be used, since the z axis expansion (Method A) is not the same as the x-y axis expansion (Method B).
Document History
TM-650 2.4.24.5
November 1, 1998
Glass Transition Temperature and Thermal Expansion of Materials Used in High Density Interconnection (HDI) and Microvias - TMA Method
This test is designed to determine the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) of dielectric materials used in high density interconnect (HDI) and microvias by...