IPC - TM-650 2.2.13.1A
Thickness, Plating in Holes Micro-Ohms Method
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 1983 |
| Status: | active |
| Page Count: | 4 |
scope:
A nondestructive inspection method for determining the quality of plated-through connections in printed wiring boards. 1.2 Theory. Copper will display a resistivity of known value depending upon the geometry of the shell and the conductivity of the copper. If the shell is not uniform, defects such as cracks, voids, or thin spots in the copper will cause the measured resistance to be higher than the theoretical value. This value is computed by using the equation given in Fig. 1.
Document History
TM-650 2.2.13.1A
January 1, 1983
Thickness, Plating in Holes Micro-Ohms Method
A nondestructive inspection method for determining the quality of plated-through connections in printed wiring boards. 1.2 Theory. Copper will display a resistivity of known value depending upon the...