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MIL-HDBK-419A VOL 2

GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES APPLICATIONS

active, Most Current
Publication Date: 29 December 1987
Status: active
Page Count: 394
scope:

INTROUUCTION.

This chapter presents the design, installation practices, test and acceptance procedures associated with the incorporation of effective grounding, bonding, and shielding for a new facility.* The major elements of the facility covered are the (1) earth electrode subsystem, (2) fault protection subsystem, (3) lightning protection subsystem, (4) signal reference subsystem, (5) bonding, and (6) shielding.

Secure transmission facility requirements are covered in Section 1.6. Supplemental measures which are needed to be incorporated in a facility to help reduce common-mode and instrumentation noise problems are presented in Section 1.9, Common-Mode Noise and Instrumentation. The special construction practices recommended to reduce facility vulnerability to the' electromagnetic pulse (EMP) threat are contained in Section 1.10, EMP Protection. Tactical grounding requirements are presented in Section 1.11, Military Mobile Facilities. Inspection and Test Procedures for a New Facility, provided in Section 1.13, should be utilized in verifying that recommended practices and procedures are properly implemented and to help establish a performance baseline against which future measurements can be compared.

To obtain optimum performance of electronic equipment and personnel safety while providing adequate protection against power system faults, EMP, and lightning strikes, thorough consideration must be given to the grounding system for the building; to the bonds needed and the method of their implementation; and to the shielding needed throughout the building for personnel safety and equipment interference control. For a new facility, the requirements in each of these areas are defined and appropriate design steps set forth to assure that the necessary measures are incorporated into the final structure and equipment installation.

*A new facility is considered to be one of new construction or an existing one that will undergo major renovation or major equipment reconfiguration. The project engineer shall determine the grounding requirements whenever minor equipment reconfigurations are accomplished in existing facilities. Refer to Chapter 2 for additional information.

Document History

MIL-HDBK-419A VOL 2
December 29, 1987
GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES APPLICATIONS
INTROUUCTION. This chapter presents the design, installation practices, test and acceptance procedures associated with the incorporation of effective grounding, bonding, and shielding for a new...

References

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