scope:

This specification relates to cl varnish for application to printed circuit boards either with or without wired-on components.

The varnish shall not have any deleterious effects on the markings on the board or the markings on any wired-on component.

The dried film shall protect the circuit against attack by high humidity and/or mould growth, shall have no deleterious effect on its electrical performance and shall not generate any vapours likely to cause corrosion of unprotected metal surfaces.

It shall not be necessary to remove the film when carrying out soldering operations on the circuit.