JEDEC JESD 59
Bond Wire Modeling Standard
active, Most Current
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| Organization: | JEDEC |
| Publication Date: | 1 June 1997 |
| Status: | active |
| Page Count: | 14 |
scope:
This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.
Document History
JEDEC JESD 59
June 1, 1997
Bond Wire Modeling Standard
This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.
References
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