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IPC-7526

Stencil and Misprinted Board Cleaning Handbook

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Organization: IPC
Publication Date: 1 February 2007
Status: active
Page Count: 32
scope:

This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste application processes.

Purpose The purpose of this handbook is to provide a basic understanding of stencil/misprint cleaning processes. The handbook serves as a guide to users or prospective users of stencil/misprint cleaning technology.

Document History

IPC-7526
February 1, 2007
Stencil and Misprinted Board Cleaning Handbook
This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste...

References

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