Stencil and Misprinted Board Cleaning Handbook
|Publication Date:||1 February 2007|
This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste application processes.
Purpose The purpose of this handbook is to provide a basic understanding of stencil/misprint cleaning processes. The handbook serves as a guide to users or prospective users of stencil/misprint cleaning technology.