scope:

This standard sets forth the dimensional parameters, performance, and the application criteria for the UCF when used to house electronics and optical equipment in communication carrier spaces. The requirements shall be used in the design, construction, and provisioning of UCF supplied to the communications industry to house electronics equipment.

Purpose

The purpose of this document is to establish requirements for general-purpose equipment UCF with industry compatible dimensions and minimum performance capabilities. The UCF shall provide consistent external dimensions for planning and engineering equipment areas in the communications carrier space.

UCF manufacturers will utilize the requirements for designing and providing communications providers and suppliers with industry-compatible UCF. Electronic equipment manufacturers will utilize dimensional parameters in the development of products to be housed in the UCF. Integrators will utilize the framework to supply systems composed of either their own equipment or third party equipment to service providers. Service providers may plan telecom facility equipment areas based on the UCF dimensions. Minimum performance parameters have been developed for the UCF to assure consistent load carrying capabilities and resistance to external loads. The UCF provides protection for equipment and front/rear cabling from aisle traffic by establishing consistent external dimensions. Minimum safety parameters are established to reduce overturning risks of loaded frames. Equipment cooling airflow patterns are discussed in the design and construction of the UCF. Other details covered by these requirements include internal cable management and support requirements, cable entry, junctioning details to adjacent UCF, and securing of UCF.

These requirements will:

•  Be used with present and future network equipment.
•  Provide improved compatibility between equipment suppliers' products.
•  Provide cable management guidelines.
•  Establish minimum physical performance parameters.
•  Improve the hardware installation accessibility.
•  Establish cooling air path protocol.
•  Establish dimensional design parameters for housed equipment.