scope:

This present document proposes mechanical and electrical requirements for wireless module implementations. This includes the SMT pad layout and common interface assignments for essential pads including some general electrical characteristics. Certain aspects such as z-height, shielding geometry and weight are not defined by the present document.

The SMT module pad configurations defined in the present document are primarily intended to allocate specific pad functionalities that need to be routed on the host device to the respective pads on the SMT module. Although many interfaces may be defined in the various pad configurations, it does not necessarily imply that all interfaces need to be supported at the same time. The assigned allocations are intended to enable the module supplier and host device integrator to design compatible circuits with aligned pad assignments as specified.