UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

NPFC - MMM-A-1754

ADHESIVE AND SEALING COMPOUND, EPOXY, METAL FILLED

active, Most Current
Buy Now
Organization: NPFC
Publication Date: 1 July 1973
Status: active
Page Count: 7
scope:

This specification establishes the requirements for one type of metal filled, room temperature curing, two part epoxy adhesive and sealing compound.

intended Use:

An epoxy based adhesive, using a polyamide activator, in general, may be expected to act as an adhesive, sealing compound, or molding compound for both general purpose and structural applications,... View More

Document History

April 8, 2019
ADHESIVE AND SEALING COMPOUND, EPOXY, METAL FILLED
A description is not available for this item.
July 12, 2001
ADHESIVE AND SEALING COMPOUND, EPOXY, METAL FILLED
A description is not available for this item.
MMM-A-1754
July 1, 1973
ADHESIVE AND SEALING COMPOUND, EPOXY, METAL FILLED
An epoxy based adhesive, using a polyamide activator, in general, may be expected to act as an adhesive, sealing compound, or molding compound for both general purpose and structural applications,...

References

Advertisement