IEC/TR 60068-3-12
Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile
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| Organization: | IEC |
| Publication Date: | 1 March 2007 |
| Status: | inactive |
| Page Count: | 20 |
| ICS Code (Environmental testing): | 19.040 |
scope:
This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste.
This process covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components).
Study A addresses requirements needed in the production of automotive electronic control units (ECU). These requirements include, but are not limited to, measurement and production tolerances.
Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes.
Document History
October 1, 2022
Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile
This part of IEC 60068, which is a Technical Report, describes the creation of temperature-time profiles (in specific envelope profiles) for reflow soldering of electronic assemblies, considering...
October 1, 2014
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
This part of IEC 60068, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste.
This...
IEC/TR 60068-3-12
March 1, 2007
Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile
This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste....