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IEC/TR 60068-3-12

Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile

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Organization: IEC
Publication Date: 1 March 2007
Status: inactive
Page Count: 20
ICS Code (Environmental testing): 19.040
scope:

This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste.

This process covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components).

Study A addresses requirements needed in the production of automotive electronic control units (ECU). These requirements include, but are not limited to, measurement and production tolerances.

Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes.

Document History

October 1, 2014
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
This part of IEC 60068, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This...
IEC/TR 60068-3-12
March 1, 2007
Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile
This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste....

References

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