UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

New! AI Engineering Assistant 
- Trained on our vast library of engineering resources.

BSI - BS EN 62572-3

Fibre optic active components and devices - Reliability standards Part 3: Laser modules used for telecommunication

active, Most Current
Buy Now
Organization: BSI
Publication Date: 30 June 2016
Status: active
Page Count: 26
ICS Code (Other fibre optic equipment): 33.180.99
ICS Code (Optoelectronics. Laser equipment): 31.260
ICS Code (Fibre optic systems in general): 33.180.01

Document History

BS EN 62572-3
June 30, 2016
Fibre optic active components and devices - Reliability standards Part 3: Laser modules used for telecommunication
A description is not available for this item.
BS EN 62572-3
August 31, 2014
Fibre optic active components and devices - Reliability standards Part 3: Laser modules used for telecommunication
A description is not available for this item.
BS EN 62572-3
March 31, 2012
Fibre optic active components and devices - Reliability standards Part 3: Laser modules used for telecommunication
A description is not available for this item.

References

This document references:
IEC 60747-1 - Semiconductor devices – Part 1: General
Published by IEC on August 1, 2010
This part of IEC 60747 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A).
This document references:
IEC 60749-1 - Semiconductor devices – Mechanical and climatic test methods – Part 1: General
Published by IEC on August 1, 2002
A description is not available for this item.
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
This document references:
EN 60068-2-1 - Environmental testing - Part 2-1: Tests - Test A: Cold
Published by CENELEC on April 1, 2007
A description is not available for this item.
This document references:
EN 60749-25 - Semiconductor devices Mechanical and climatic test methods Part 25: Temperature cycling
Published by CENELEC on September 1, 2003
A description is not available for this item.
This document is referenced by:
EN 62572-3 - Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
Published by CENELEC on June 1, 2016
This part of IEC 62572 deals with reliability assessment of laser modules used for telecommunication. The aim of this standard is – to establish a standard method of assessing the reliability of...
View Less
View All
Advertisement