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BSI - BS EN 62631-1

Dielectric and resistive properties of solid insulating materials Part 1: General

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Organization: BSI
Publication Date: 30 September 2011
Status: active
Page Count: 20
ICS Code (Insulating materials in general): 29.035.01

Document History

BS EN 62631-1
September 30, 2011
Dielectric and resistive properties of solid insulating materials Part 1: General
A description is not available for this item.
BS EN 62631-1
September 30, 2011
Dielectric and resistive properties of solid insulating materials Part 1: General
A description is not available for this item.

References

This document references:
EN ISO 291 - Plastics - Standard atmospheres for conditioning and testing
Published by CEN on May 1, 2008
A description is not available for this item.
This document references:
EN 60216-1 - Electrical insulating materials - Thermal endurance properties - Part 1: Ageing procedures and evaluation of test results
Published by CENELEC on July 1, 2013
This part of IEC 60216 specifies the general ageing conditions and procedures to be used for deriving thermal endurance characteristics and gives guidance in using the detailed instructions and...
This document references:
IEC 60050-212 - AMENDMENT 2 International Electrotechnical Vocabulary - Part 212: Electrical insulating solids, liquids, and gases
Published by IEC on August 1, 2015
A description is not available for this item.
This document is referenced by:
G183 - Guidelines for the Engineering of Underfloor Arc and Thermal Protection Requirements
Published by LUL on April 1, 2019
This guidance applies to LU procurement agents, suppliers contracted under any subsequent specifications and technical staff within LU. The scope especially applies to the following: a) arc, arc...
This document is referenced by:
SAE AMS59-047 - Conformal Coatings for Panels, Printed Circuit and Panels, Electronic Circuit
Published by SAE on January 1, 2021
This SAE Standard defines the general requirements and provides a system for the control of quality for conformal coatings suitable for application to printed circuit assemblies. The material covered...
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