Techniques for Suspect/Counterfeit EEE Parts Detection by X-ray Fluorescence Test Methods
|Publication Date:||1 October 2016|
XRF technique for counterfeit detection is applicable to electrical, electronic and electromechanical (EEE) parts as listed in AS6171 General Requirements. In general, the detection technique is meant for use on piece parts prior to assembly on a circuit board or on the parts that are removed from a circuit board. The applicability spans a large swath of active, passive and electromechanical parts.
If AS6171/3 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
The purpose of this document is to provide information and instructions on how to use XRF as a technique to verify the materials and finishes of EEE parts to compare with the original design, construction and material requirements. The process of detection is based on identification of elements (or absence thereof) in a component. The indication of counterfeit risk can also be based on the presence of and concentration levels of materials under consideration. The counterfeit detection process using XRF can be applied to components as received or on delidded, decapsulated, or otherwise prepared parts. For reliable decision making, findings from XRF analysis need to be compared with material composition information of appropriate exemplars, compared with each other in the lot, or compared with the original manufacturer's documented specifications.