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IEC 60191-6-16

Mechanical standardization of semiconductor devices – Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

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Organization: IEC
Publication Date: 1 April 2007
Status: active
Page Count: 26
ICS Code (Semiconductor devices in general): 31.080.01

Document History

IEC 60191-6-16
April 1, 2007
Mechanical standardization of semiconductor devices – Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
A description is not available for this item.

References

This document is referenced by:
IEC 61240 - Piezoelectric devices – Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection – General rules
Published by IEC on October 1, 2016
This International Standard sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this document as SMD)...
This document is referenced by:
EN 61240 - Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
Published by CENELEC on January 1, 2017
This International Standard sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this document as SMD)...
This document is referenced by:
EN 61837-3 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures
Published by CENELEC on December 1, 2015
This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which...
This document is referenced by:
IEC 60191-6-12 - Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guidelines for fine-pitch land grid array (FLGA)
Published by IEC on June 1, 2011
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
This document is referenced by:
EN 62150-5 - Fibre optic active components and devices - Test and measurement procedures - Part 5: Wavelength channel tuning time of tuneable transmitters
Published by CENELEC on August 1, 2017
This part of IEC 62150 specifies test and measurement procedures for the wavelength channel tuning time of tuneable transmitters. It applies to laser transmitters, and to the transmitter portion of...
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