Semiconductor devices - Micro-electromechanical devices Part 27: Bond strength test for glass frit bonded structures using micro-chevrontests (MCT)
|Publication Date:||1 January 2017|
|ICS Code (Other semiconductor devices):||31.080.99|
This part of IEC 62047 specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.
The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevronsample
The exemplary setup of the micro-chevron-test is given in Figure 1.
These operational instructions are applicable for symmetrically glass frit bonded siliconsilicon- stacks, i.e. the joint upper and lower chip of the chevron sample exhibit identical thickness and mechanical properties.
The method is suitable for test samples, which are either produced directly from individual chips in corresponding dimensions, or for integrated samples, which have been singled out from processed wafers using suitable methods.
This document determines preferential dimensions for samples as well as parameters for the test conditions. Deviating geometries can potentially influence the viability of the tests as well as the comparability of the results. On that score, all parameters are determined and documented accurately.