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IEC/PAS 61249-3-1

Materials for printed boards and other interconnecting structures – Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

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Organization: IEC
Publication Date: 1 May 2007
Status: inactive
Page Count: 34
ICS Code (Printed circuits and boards): 31.180

Document History

IEC/PAS 61249-3-1
May 1, 2007
Materials for printed boards and other interconnecting structures – Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
A description is not available for this item.

References

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