IEC/PAS 61249-3-1
Materials for printed boards and other interconnecting structures – Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
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| Organization: | IEC |
| Publication Date: | 1 May 2007 |
| Status: | inactive |
| Page Count: | 34 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
IEC/PAS 61249-3-1
May 1, 2007
Materials for printed boards and other interconnecting structures – Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
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