scope:

This part of IEC 62239, which is a technical specification, applies to the development of COTS assembly management plans (CAMPs) for the integration and management of electronic COTS assemblies (see 3.1.13 and 3.1.20) in electronic systems used in the ADHP markets where reliability is generally critical.

NOTE 1 Best practices for managing the electronic components within the electronic assemblies are described in IEC TS 62239-1 and SAE EIA-STD-4899 which describe the electronic component management program (ECMP). In cases where the electronic components can be identified and managed at the component level, ECMP can be considered as an option to manage the components.

NOTE 2 The distinction between an electronic component and an electronic assembly is provided by the definitions in Clause 3. This distinction between an electronic component and an electronic assembly is not always recognized by industry: for example, filters, contactors, power supply modules, relays, magnetic assemblies, etc., can be considered as either components or assemblies. In each application it is considered a best practice for the user of this document to clarify this distinction.

Depending on program or product line requirements and/or the technical characteristics of the electronic COTS assemblies and in agreement with the customer, the electronic COTS assembly management plans (CAMPs) could consider tailoring the requirements of this document. See Annex A.

Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion.