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SAE AMS2418

Plating, Copper

active, Most Current
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Organization: SAE
Publication Date: 1 March 2017
Status: active
Page Count: 8
scope:

Form

This specification covers the requirements for electrodeposited copper.

Application

This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required or permitted, to prevent decarburization, to enhance solderability, or to provide a source of copper for furnace brazing, but usage is not limited to such applications.

Classification

Plating covered by this specification is classified as follows:

Type 1 - Engineering plating

Type 2 - Plating for masking

Type 1 shall be supplied if no class is specified.

Document History

AMS2418K
December 1, 2021
Plating, Copper
Form This specification covers the requirements for electrodeposited copper. Application This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces...
SAE AMS2418
March 1, 2017
Plating, Copper
Form This specification covers the requirements for electrodeposited copper. Application This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces...
SAE AMS2418
February 1, 2011
Plating, Copper
Form This specification covers the requirements for electrodeposited copper.  Application This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces...
SAE AMS2418
January 1, 2006
Plating, Copper
Form: This specification covers the requirements for electrodeposited copper.  Application: This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces...
SAE AMS2418
July 1, 1998
Plating, Copper
SCOPE: Form: This specification covers the requirements for electrodeposition of copper on metals and the properties of the deposit. Application: This process has been used typically to provide an...
SAE AMS2418
February 1, 1995
(R) Plating, Copper
A description is not available for this item.
SAE AMS2418
April 1, 1986
COPPER PLATING
Form: This specification covers the engineering requirements for electrodeposition of copper on metals and the properties of the deposit. Application: Primarily to provide an anti-seize surface, to...
SAE AMS2418
July 1, 1976
COPPER PLATING
Purpose: This specification covers the engineering requirements for electrodeposition of copper on metals and the properties of the deposit. Application: Primarily to provide an anti-seize...
SAE AMS2418
April 15, 1967
COPPER PLATING
A description is not available for this item.
SAE AMS2418
October 1, 1951
COPPER PLATING
A description is not available for this item.
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References

This document references:
B253 - Standard Guide for Preparation of Aluminum Alloys for Electroplating
December 15, 2011
This guide covers cleaning and conditioning treatments used before metal deposition (Section 5), and immersion deposit/strike procedures (Section 6) that enhance the adhesion of metals that are...
This document references:
ASTM B374 - Standard Terminology Relating to Electroplating
Published by ASTM on May 15, 2006
A description is not available for this item.
This document references:
ASTM B487 - Standard Test Method for Measurement of Metal and Oxide Coating Thickness by Microscopical Examination of Cross Section
Published by ASTM on November 1, 2020
This test method covers measurement of the local thickness of metal and oxide coatings by the microscopical examination of cross sections using an optical microscope. Under good conditions, when...
This document references:
B499 - Standard Test Method for Measurement of Coating Thicknesses by the Magnetic Method: Nonmagnetic Coatings on Magnetic Basis Metals
April 15, 2009
This test method covers the use of magnetic instruments for the nondestructive measurement of the thickness of nonmagnetic coatings over ferrous or other magnetic base metals. It is intended to...
This document references:
ASTM B504 - Standard Test Method for Measurement of Thickness of Metallic Coatings by the Coulometric Method
Published by ASTM on February 23, 1990
This test method covers the determination of the thickness of metallic coatings by the coulometric method, also known as the anodic solution or electrochemical stripping method. This standard does...
This document is referenced by:
SAE AS3564 - NUT, SELF-LOCKING, DOUBLE HEXAGON, SOLID FILM LUBRICATED, COUNTERBORED, 160 KSI, 800 °F, UNS S66286
Published by SAE on July 1, 2020
A description is not available for this item.
This document is referenced by:
MIL-DTL-21097 - CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD, GENERAL PURPOSE GENERAL SPECIFICATION FOR
Published by NPFC on August 16, 2017
This specification covers multicontact connectors for 1/16, 3/32, and 1/8 inch printed wiring boards, and for interconnections between printed wiring boards. The connectors are intended to provide a...
This document is referenced by:
AMS2420F - Plating of Aluminum for Solderability Zinc Immersion Pre-Treatment Process
Published by SAE on July 1, 2022
Purpose This specification covers the requirements for preparation of aluminum and aluminum alloys for soldering by zinc immersion pre-treatment followed by copper plating and tin or tin-zinc alloy...
This document is referenced by:
SAE AMS2434 - Plating, Tin-Zinc Alloy
Published by SAE on November 1, 2017
Purpose This specification covers the requirements for electrodeposited tin-zinc alloy plating. Application This plating has been used typically as a corrosion resistant plating where cadmium cannot...
This document is referenced by:
MIL-DTL-55302/73 - CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES, PIN, RIGHT ANGLE, ENVIRONMENTAL RESISTANT, PLUG, ELECTRICAL, POLARIZED FOR PRINTED WIRING BOARDS (.150 SPACING)
Published by NPFC on February 2, 2018
A description is not available for this item.
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