Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
|Publication Date:||1 July 2017|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).