IEC 62047-30
Semiconductor devices – Micro-electromechanical devices – Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
active, Most Current
Buy Now
| Organization: | IEC |
| Publication Date: | 1 September 2017 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Piezoelectric devices): | 31.140 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
scope:
This part of IEC 62047 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators, and its reporting schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films fabricated by MEMS process.
Document History
IEC 62047-30
September 1, 2017
Semiconductor devices – Micro-electromechanical devices – Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
This part of IEC 62047 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators, and its reporting schema to...