DS/CLC/TR 62258-3
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
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| Organization: | DS |
| Publication Date: | 21 February 2007 |
| Status: | active |
| Page Count: | 50 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products.
Document History
DS/CLC/TR 62258-3
February 21, 2007
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached...