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SAE AMS3731/10

Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible

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Organization: SAE
Publication Date: 1 November 2017
Status: active
Page Count: 4
scope:

Form: This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.

Application: Primarily for use as a casting or sealing material where high thermal expansion can be tolerated and where flammability resistance is not required.

 

Document History

SAE AMS3731/10
November 1, 2017
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible
Form: This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system. Application: Primarily for use as a...
January 1, 1993
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible
A description is not available for this item.

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