DIN EN 62047-25
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
active, Most Current
| Organization: | DIN |
| Publication Date: | 1 April 2017 |
| Status: | active |
| Page Count: | 23 |
| ICS Code (Electromechanical components in general): | 31.220.01 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
DIN EN 62047-25
April 1, 2017
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
A description is not available for this item.
May 1, 2014
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014)
A description is not available for this item.