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DSF/FprEN 62047-4

Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS

pending
Organization: DS
Status: pending
Page Count: 23
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 62047 describes generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS. This standard specifies general procedures for quality assessment to be used in IECQ-CECC systems and establishes general principles for describing and testing of electrical, optical, mechanical and environmental characteristics.
This part of IEC 62047 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described in this standard are basically made of semiconductor material. However, the statements made in this standard are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials.

Document History

November 5, 2010
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
IEC 62047-4:2008 describes the generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for...
DSF/FprEN 62047-4
Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS
This part of IEC 62047 describes generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series...
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