TSE - TS EN 60749-21
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
inactive
| Organization: | TSE |
| Publication Date: | 22 November 2011 |
| Status: | inactive |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Bu standard, tutturmak icin kalay kursun (SnPb) veya kursunsuz(Pb olmayan) lehim kullanilarak baska bir yuzeyle birlestirilmesion gorulen eleman paketi baglanti uclarinin lehimlenebilirligini
Document History
January 31, 2012
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
A description is not available for this item.
TS EN 60749-21
November 22, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Bu standard, tutturmak icin kalay kursun (SnPb) veya kursunsuz(Pb olmayan) lehim kullanilarak baska bir yuzeyle birlestirilmesion gorulen eleman paketi baglanti uclarinin...
January 17, 2006
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
This standard applies to ceramic tile grouts for internal and external tile installations on walls and floors.